Researchers from the Chinese Academy of Sciences have achieved a major breakthrough in materials science by developing a high-performance copper foil that simultaneously delivers ultra-high strength, high electrical conductivity and exceptional thermal stability.
Copper foil is a critical component in modern technologies, including semiconductor chips and lithium-ion batteries, reports
CCTV+, a partner of TV BRICS. However, conventional materials have long faced a trade-off: improving one property – such as strength – typically reduces conductivity or thermal stability.
The research team addressed this challenge by engineering a 10-micrometre-thick copper foil with a highly refined internal structure. The material features nanoscale grains and precisely distributed ultra-fine domains, enabling it to maintain stability while enhancing performance across all key parameters.
The newly developed copper foil demonstrates tensile strength of up to 900 megapascals, approximately double that of standard copper alloys. At the same time, it retains around 90 per cent of the conductivity of pure copper, significantly surpassing materials with comparable strength.
In addition, the material shows outstanding thermal stability, maintaining its properties over extended periods without degradation. Experts believe that the breakthrough is expected to have far-reaching applications across advanced electronics and new energy systems.